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Technical features of the reflow soldering of electronic components
  Published:2012-06-04 09:17:25   Views:

Electronic components, welding technology plays an extremely important role in the assembly of electronic products, reflow soldering is a pre-welding parts (pad) to cast the right amount and appropriate form of the PCB solder paste and then put a surface mount components, the use of an external heat source to the solderreflux reach the welding process of welding requirements into groups, or point by point. This article describes the technical knowledge of the points on the reflow, and hope to discuss with you.

Reflow only cast parts need solder, a significant reduction in the use of solder;
   
Reflow does not require as wave soldering required to components directly dipping in molten solder, so the components are subject to thermal shock;
   
3, may be local heat source, which can be on the same substrate with different reflow soldering process for welding;
   
4, when the components placement position must deviate from the role of the molten solder surface tension, as long as the solder cast position is correct, reflow can be welding this small deviation is corrected automatically, so that the components fixed in the correct position;
   
, Reflow can control the solder who discharge to avoid the generation of bridging defects;
   
6, the solders are generally not mixed with impurities, to properly maintain the composition of the solder in the solder paste reflow soldering.
   
Reflow soldering technology be classified in accordance with the heating method: vapor phase reflow, infrared reflow, infrared hot air reflow, laser reflow soldering, Reflow and tool heating reflow.

According to the reflow profile and reflow principle, reflow soldering machine on the market today are generally simple four zone reflow machine, there is a large six or eight or even twelve temperature zone reflow machine, you can purchase according to different needs.