News categories
NewsLocation:Home >> News
Connector manufacturers competitive take the high-speed application market
  Published:2014-05-28 10:51:19   Views:

Network, server and storage equipment application is more and more high requirements for the speed, the maximum speed reached 12Gbps or even higher, which prompted the connector manufacturers to develop high speed and high density connector platform. Along with this trend, the performance of connector impedance, crosstalk and insertion loss are in continuous improvement. Anfeno (Amphenol), ERNI, FCI, Molex, Samtec, Stewart, Connector, Tyco Electronics (Tyco) and Elinker connector manufacturers have introduced new products to meet the high speed applications, from 3 to 25Gbps.

Following the industry standard, satisfy more applications

The connector manufacturers have also committed to high-speed connectors to in line with the development of industry specifications. For example, Yamaichi Electronics developed a standard MicroTCA backplane connector. What MicroTCA PICMG association is currently being drafted, the AdvancedTCA and AdvancedMC standards, the low-end telecommunications applications. The CN080 connector of the company for the next generation of telecommunications equipment, has the advantages of high data rate 12.5Gbps above, but also high density mounting.

FCI will set up branch offices in Shanghai to carry out the design of the Chinese customers.

In the PCI Express application, FCI developed a press type vertical card along the connector, so that the thicker the system board high speed serial PCI Express architecture is extended to the server apparatus. The new press type connector is 2.36 ~ PCB 4.19mm application and design. Each group of serial PCI Express channel by the differential transmit and receive signals on the composition, and in each direction are supports the 2.5Gbps data transmission rate. All of these connectors are fully meet the PCI Express signal and power requirements.

Similarly, Tyco also launched the 1mm spacing along the center line of the card connector, can be used for high performance of point-to-point full duplex I/O PCI Express bus standard architecture, in order to achieve high bandwidth performance.

Strengthen the differential signal of support

Transmission support for high-speed differential signals has been the main event of connector manufacturers in recent years. FCI company recently launched a high-speed serial interface, with the through hole welding or surface mount terminal, can support the differential signal, the initial rate of 3Gbps. The socket connector pin 29 right angle installation, can be used to realize the serial SCSI hard disk and blade additional data, communication and industrial equipment in the processor, memory, blade type interlayer between the board or embedded system board.

The company also launched 32 needle vertical and right angle plug, in storage and server applications, I/O controller card and backplane connection between multiple SAS or SATA cable, also supports speeds up to 3Gbps differential signal.

Samtec recently introduced a new differential pair DPAM/DPAF series display, the display area of the circuit board so that every square inch of the bandwidth to the maximum, using as many as 168 effective signal line on, can make the transmission performance of a single connector trillion bit level.

Molex company is a small form factor pluggable devices (SFP) stacked multi port connector, expanded its SFP product line. The company said, the high speed contact design can meet the needs of 4.25 Gbps SFP and speeds up to 10 Gbps, applicable to the network, storage and telecommunication applications.