Technology trends of the electronic components is determined by the requirements of the development of the electronic machine products. Miniaturization, high-speed, large capacity, intelligent, personalized, integrated several trends in the development of personal computers, automotive electronics, medical electronics, consumer electronics and other electronic machinery products, which determines the electronic components, products must the following five aspects of development to meet the development needs of the electronic machine products.
A multi-functional.
With the increasing of the electronic new product features, functions on the chip components and more diverse. Although in volume terms, the chip electronic components of the rate of up to 70%, but the development is very uneven, some components due to reasons such as technology, structure and materials, chip type is difficult. Such as bead component of the inductor structure, its function is as an inductor, but the anti-electromagnetic interference, the chip bead components has become the largest amount of a chip inductor components. The new problems faced by the design of these new components and materials are electronic components.
Two miniaturization.
Electronic products of multi-functional and portable at the same time the electronic components that maintain the original performance based on the ever-shrinking size of the components. Shrink in size to involve a range of materials and process issues, these issues are a hot topic of electronic components, new materials and cutting-edge technology (such as nanotechnology, etc.) has begun to be used in the process of ultra-small components.
Three high-frequency, broadband.
The trend of electronic products to the high-frequency (microwave band) and the development of very strong, such as the development of wireless mobile communications to 2GHz, Bluetooth technology is 2.4GHz, the short-range wireless data exchange system up to 5.8GHz. In addition, more and more high-speed digital circuit products, the transfer rate of optical communication from the-2.5Gbps development to 10Gbps. These advances have a higher demand for electronic components.
Four integrated modular.
The manufacturing process of electronic components in the material and technical differences, has long been used in the form of discrete components. Although it has been in the miniaturization of chip components with a series of efforts, but compared with the highly integrated semiconductor devices, and its development is relatively slow.
Five green.
In the manufacturing process of electronic components, tend to use large amounts of toxic materials, such as cleaning agents, solvents, solder, and some raw materials. Part of the finished electronic components sometimes contain toxic substances such as mercury, lead, cadmium, and so on. Some developed countries have legislation to disable these harmful substances, to promote green electronic. China's electronic components industry is also facing the subject, a lot of technical problems to be solved.