The design of the PCB terminals are moving in small form factor, high density and high current, high voltage and high-power direction in most cases, technology aimed at the smaller shape a larger power is expected that thephase of the study to a certain stage, the goal of the next stage is to reduce the wiring, the overall cost of installation and manufacture.

 
In the process, the terminal product in the assembly will be faced with a temperature-and security-related issues to promote lead-free components due to the European Union and Japan after 2006, all on the PCB components shall comply with the standards. means that the terminal product in the manufacturing process, with solder pins will have to stop using the standard tin / lead plating, but must also withstand up to 260 ° C temperature in order to adapt to the requirements of lead-free soldering process.

SMT applications, the industry still continue to develop perforation reflow (THR) technology, because the technology allows higher welding temperature, the lead components to be assembled by the existing standard SMT manufacturing line.

In fact, in recent compact design, the terminal manufacturers such as Shanghai Lian Jie Electric Co., Ltd. is generally spring pressure in order to obtain a relatively high contact density, because the screws in has become an important factor in the hinder terminal product miniaturization. In addition, with the rising demand for electrical power system equipment, for the corresponding system of the terminal product of the rated power will increase accordingly.